McDarmid Adhesives for Power Electronics
We offer a variety of new joining materials suitable for chip bonding, including heat-resistant fatigue solder and EV materials.
MacDermid Performance Solutions has finally begun to seriously address the lead-free transition of high melting point solders, which had previously been excluded due to the lack of suitable solder materials. At the same time, there is a demand for bonding materials that can fully leverage the capabilities of next-generation power semiconductors. Alpha Argomax sinter paste is a bonding material that can meet both of these challenging requirements. Alpha Assembly Solutions is also focusing on the development of high thermal conductivity epoxy pastes.
basic information
**Argomax Sinter Paste** Alpha Argomax Sinter Paste enables the manufacturing of SiC GaN power module devices with a Tjmax of over 200°C, contributing to improved reliability of chip bonding and overall cost reduction. **Features** - Improved bonding reliability: More than 5-10 times that of solder bonding - Low-pressure sintering process: Improved yield - Shortened bonding process time: Increased productivity **Atrox Conductive Paste** Alpha Atrox Conductive Paste is suitable for various die attach applications and can be used as a pressureless hybrid sintering agent. Its high thermal conductivity (10-100 W/mK) enables the realization of lead-free solder packages. **PowerBond Series** - Tjmax = 175°C - Ideal for chip bonding and heat sink bonding Power Bond 2050 - Melting point: 235-240°C Power Bond 2110 - Melting point: 222-266°C **True Height** Solder preform
Price information
Please contact Seiwa Co., Ltd.
Delivery Time
Model number/Brand name
ALPHA Algomax Atrox PowerBond TrueHeight
Applications/Examples of results
Power semiconductors (including logic) Power discrete LED & laser Power modules High-power semiconductors, etc. They are particularly suitable for inverters for hybrid vehicles, EVs, power transmission, railways, etc.
