McDermid solder-based thermal conductive materials
McDermid solder-based thermal interface material sTIM solves thermal issues in high-performance power semiconductors.
sTIM (Solder Thermal Interface Material) is a non-adhesive, non-organic solder-based thermal interface material. It achieves high thermal conductivity for high-performance power semiconductor applications, which are approaching the limits of conventional organic TIMs, supporting next-generation thermal management. MacDermid Alpha is a global supplier in the semiconductor packaging field and has a track record of receiving the Intel SCQI Award in the thermal interface materials sector.
basic information
◆Very high thermal conductivity due to metal/solder type ◆High reliability due to the absence of organic materials ◆Ideal for high power and high heat generating devices
Price range
Delivery Time
Model number/Brand name
STIM McDermid KESTER
Applications/Examples of results
◆Thermal interface material between the die (chip) and the heat spreader ◆Thermal interface material between the heat spreader and the heat sink
Detailed information
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