U packing, V packing, dust seals, and various rubber molded products.
We can accommodate small lots! We will produce using appropriate processing methods considering shape, quantity, and other factors.
Our company processes "U-packings, V-packings, dust seals, and various rubber molded products." Considering the shape, quantity, delivery time, etc., we manufacture using appropriate processing and molding methods such as mold molding, roll steaming, cutting processing, and extrusion molding. Additionally, we can accommodate small lots. Please contact us if you have any requests. [Key Points] ■ Manufacturing using appropriate processing and molding methods considering shape, quantity, delivery time, etc. ■ Capable of handling small lots *For more details, please download the PDF or feel free to contact us.
basic information
【Specifications】 ■Processing Methods: Mold forming, rolled steaming forming, cutting processing, extrusion molding ■Materials: U packing, V packing, dust seals, various rubber molded products ■Sizes ・U/V packing and dust seals: standard sizes ・Various rubber molded products: custom sizes ■Minimum Order Quantity: From 1 piece～ *For more details, please download the PDF or feel free to contact us.
Price range
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Applications/Examples of results
[Usage] ■ Seals for pistons and rotation, various rubber parts *For more details, please download the PDF or feel free to contact us.
Detailed information
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MiniLab-026-TE/LTE/SP The smallest model in the MiniLab series, a standalone thin film experimental device with a 19-inch single rack frame. It has a compact size requiring a minimum installation space of 600mm in width and 600mm in depth, allowing for TE (resistive heating evaporation), LTE (organic thin film evaporation), and SP (sputtering) experiments. Despite its small size, it features PID automatic loop film deposition control (manual operation is also possible) and simultaneous deposition capabilities.
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MiniLab-026-GB (Glove Box Storage Type) A glove box model with the MiniLab-026 chamber installed in the workbench and the control unit stored underneath the bench.
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MiniLab-026 Etch/Anneal Station A device equipped with an RF dry etching stage and a substrate heating stage in the MiniLab-026 chamber. It comes in two models: a standalone version housed in a MiniLab series 19-inch rack frame and a glovebox version called MiniLab-026-GB. This product is a collaborative development with the University of Manchester's graphene group. It contributes to TMDC and 2D development through a unique RIE system with low damage and excellent control precision at under 30W.
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MiniLab-060-TE/LTE/EB/Sputtering Device The "MiniLab-060" series is an R&D device that can be configured for a wide range of purposes, including TE (resistive heating evaporation), LTE (low-temperature organic film deposition), EB evaporation, and RF/DC magnetron sputtering, by modularly incorporating a rich variety of components. There are also many options available, such as vertical lift, substrate rotation, heating and cooling stages, and load locks. (The photo shows the EB model equipped with a 6 pockets evaporation source.)
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The MiniLab-060 PECVD device is a semi-automatic plasma CVD machine equipped with up to four gas lines, RF/DC power units, and a substrate heating and rotating stage (max 1200°C). It features a high vacuum specification with a 60L volume chamber, equipped with RP (DP) + TMP, allowing for stable automatic control of vacuum and gas pressure through PLC/MFC. It is capable of conducting film formation experiments for wafer sizes ranging from 1 to 8 inches.
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MiniLab-080-TE/LTE/SP Box-type chamber: A higher model than the MiniLab-060, which can add a load lock mechanism to an 80-liter large chamber with a chamber height of 570mm. The long adjustment range of the T/S distance contributes to improved film uniformity.
