All products and services
31~60 item / All 87 items
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DLC De-coating Device (Plasma Cleaner for Precision Molds)
A plasma cleaning device with extensive experience in removing DLC films from aspherical lenses. An essential dry film removal device for the repair of high-value-added molds.
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Single Wafer Plasma Ashing System (SWP Series)
Damage-free, high throughput, multi-purpose compatible high-end devices, compound semiconductors, and MEMS. Extensive track record and comprehensive support. New type now available.
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Corrosion-resistant water-sealed vacuum pump SW-AS series (stainless steel)
Corrosion-resistant stainless steel (equivalent to SUS316) water-sealed vacuum pump.
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Multi-chamber sputtering device
A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.
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Vacuum exhaust device (vacuum pump unit)
Exhaust system unit with proven performance and reliability. Designed to handle applications that are difficult with a single pump. Enhanced reliability with combinations tailored to the purpose and additional peripheral equipment.
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Single-wafer plasma etching device "EXAM-Σ"
Carefully responding to niche demands. Light etching and ashing for thin wafers and double-sided processing, compact type CtC etching equipment.
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AlN template creation device (sputtering device for oriented AlN films)
AlN templates for UV-LEDs using sputtering. AlN films with high crystallinity and C-axis orientation can be created by sputtering. Latest model deposition equipment.
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Mass production vacuum soldering device (formic acid compatible type)
Standard device for voidless soldering. Proven and reliable hardware and software supporting automotive power device modules.
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Demonstration of the load lock type sputtering device (single wafer transport type) is currently in progress.
From discrete components to advanced devices, from R&D to mass production. A compact, high-quality, multi-purpose CtoC type sputtering system.
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Hybrid hard film coating device (DLC-CVD + PVD device)
Composite coating device for CVD-DLC and hard film PVD. Smooth surface PVD film + high-rate DLC. Hardness + tribological thin film.
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DLC coating device for infrared reflection prevention film
A DLC film with high infrared transmittance is formed on both sides of the substrate at a high rate. Achieving next-generation IR coating with stable hard and advanced soft materials.
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Standard Batch Type Vapor Deposition Equipment (AMF Series)
Standard series for electronic device applications. A reliable and comprehensive lineup ranging from multipurpose small research units for R&D to mass production for well-established back electrode applications.
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Water-repellent coating device testing now accepting applications.
Water-repellent coating with plasma treatment. Compatible with resin films through low-temperature processing. Development support through sample testing. Compact type plasma surface treatment device.
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Large vacuum oven
Uniform heating and stable heating under high vacuum or atmospheric pressure; drying, degassing, baking, annealing; multipurpose mass-production vacuum oven.
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Hydrogen annealing device (for electronic devices, currently supporting sample testing)
Uniform heating in atmospheric pressure hydrogen atmosphere. Providing flexible hard support and sample testing with abundant experience and track record for thin films, wafers, compound, and ceramic substrates.
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Mass production plasma cleaning device (large plasma cleaner)
Supports automated mass production lines. Inline type, sheet type, and various types with flexible hardware configurations, all with a proven track record of high effectiveness of vacuum plasma in mass production lines.
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Ittria Coating Device (AF-IP Device)
A yttrium (Y2O3) film with excellent plasma resistance is formed using the PVD method. A thick film (10μm) is achieved with a newly developed ion plating method.
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Simple experimental sputtering device (SRV3100 type)
Compact-type sputtering device exclusively for small substrate, achieving low cost with fully manual operation. Standard type for research and experiments.
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Simple experimental deposition device (EM-645 type)
Simple, compact, high-performance; ideal for experiments and basic research; flexibly customizable according to user needs; standard-type deposition device.
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Large Vapor Deposition Device (AAH Type for Automotive Parts)
Large deposition equipment with extensive experience in film formation for resin exterior products; optimal for film formation of long resin molded products; resin metallization and discontinuous film formation; standard type for mass production of automotive parts.
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Arc filament type ion plating device
High-speed formation of a dense oxide film with a thickness of up to 10 μm. Equipped with a newly developed ionization mechanism, a CVD alternative high-density ion plating device.
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Mass production compatible batch-type sputtering system (Model STH10311)
A batch-type sputtering device equipped with four substrate holders for φ410 substrates, achieving excellent film thickness uniformity within ±5% in the same substrate holder.
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Ultra-High Vacuum Sputtering Equipment (Model STM2323)
Ideal for research and development of advanced thin film devices. A customizable single-sheet ultra-high vacuum inline system. Responding to demands with a wealth of options and flexible support.
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SDR-type roll-to-roll sputtering device (RtoR type sputtering device)
Currently responding to sample tests, developing films and metal foils for flexible devices and advanced functional materials, and supporting mass production. Process support with demo equipment.
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Batch type SWP assembling device
Damage-free, high rate, large area compatible, complete removal of ion damage, achieving complete radical processing. High-performance plasma ashing device.
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Research and development sputtering equipment
Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.
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Plasma etching device "EXAM" sample testing now accepting applications.
A compact batch-type plasma etching device that supports sub-micron etching and features process support through sample testing.
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Standard Batch Type Sputtering Device (SRV Series)
Multi-functional, compact, flexible support, a standard lineup with proven results and trust.
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Vertical vacuum annealing device
Wafer process-compatible full-scale production system for annealing, sintering, and polyimide curing, supporting high throughput with mini-batch and rapid cooling mechanism.
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Polyimide cure device (300mm wafer compatible clean bake device)
300mm wafer-compatible polyimide cure, baking, low-temperature annealing, compatible with multilayer substrates. Thermal processing equipment for mass production of advanced electronic devices.
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