Minimum φ0.2mm! Low thermal stress! Laser soldering device for narrow areas.
Reduce the consumable costs of soldering irons! Rework in tight spaces is also possible! Reduce deterioration management and replacement labor for soldering irons, as well as decrease quality control labor.
A semiconductor laser soldering system developed by a soldering iron manufacturer that intentionally denies its own products! Utilizing a high-output semiconductor diode laser as the heat source, it achieves quality improvement by non-contact localized heating of mounted components for soldering. ■ Laser used: Adopts single-wavelength and coherent (interferable) light The output area can be narrowed down to standard φ0.4 and φ0.6 (minimum 0.2mm), making it ideal for localized soldering. ■ Minimizes thermal impact on narrow-pitch component mounting and surrounding areas. ■ Compatible solders Uses "rosin-core solder," "solder paste," "solder balls," and other "solder preforms." ■ The laser light is locally irradiated onto the pad surface and solder for speedy bonding! ■ By adopting laser soldering methods, it reduces the constraints of automated equipment, enabling more stable bonding quality than manual work.
basic information
Recommended Usage: Ideal for mounting narrow pitch components on small circuit boards.
Price range
P6
Delivery Time
OTHER
It may vary depending on the device configuration, so please feel free to contact us.
Model number/Brand name
Laser soldering device
Applications/Examples of results
Small lot, diverse product production Small-sized mounting boards Rework of circuit boards, etc.
