進和 戦略営業推進室 Official site

Introduction to Shinwa's Initiatives We are conducting joint research on laser soldering methods compatible with surface mount and through-hole mounting, in collaboration with Senju Metal Industry, Japan Unix, and Shinwa. We aim to establish the conditions for laser soldering for through-hole mounting, developing THD and SMD in parallel.

【Senju Metal Industry】 Development and provision of laser solder paste compatible with inserted components - Suppression of powder spread after application - Suppression of solder ball generation 【Japan Unix】 Manufacturing of area laser soldering equipment and establishment of conditions - Reduction of cycle time by combining area laser + solder paste (compared to spot laser + wire solder) - Space-saving of equipment by implementing vertical irradiation with area laser 【Shinwa】 Manufacturing of application equipment for area laser solder paste and establishment of conditions - Reduction of application time through screw application - Improvement of stability in the variation of application amount on actual products - Realization of stable application through screw application - Development of a new type of application machine - Ensuring further stability through weight feedback control Each company involved in the research group is advancing research in their respective fields.

In recent times, with the increasing demand for soldering, we are anticipating its use in surface mount and through-hole mounting.