Information about Boschman's sintering business

Boschman's sintering equipment contributes to the high density and efficiency of power semiconductors!

The sintering equipment will meet the requirements for power semiconductors such as high output, high voltage, high current, high-speed operation, high frequency, increased thermal capacity, and high efficiency. From early 2025, Shinwa will allow you to try sintering. - We will provide comprehensive support from sintering prototypes to prototype evaluation. - Please consult us regarding the design and specification customization of equipment for mass production. - We also accommodate trials with your own sintering materials. - We have equipment available for both pre- and post-sintering processes.

basic information

**Characteristics of Sintering Agents** There are features such as improved thermal conductivity efficiency, enhanced reliability, and the characteristic of not remelting due to high melting points. Melting point of the joint: 962°C Joining process temperature: 250–300°C Thermal conductivity: >200 W/m·°C Need for pressure: Yes