Quspa SOALA
Unifying coating and area laser soldering. Achieve space-saving and time-saving with this one machine!
**Features** ◆ Space-saving By consolidating two different processes into one, we have achieved a 30% reduction in space compared to the traditional two equipment setups. Inline integration becomes easier. ◆ Time-saving By adopting area lasers, simultaneous soldering can be performed on multiple pins. A cycle time of 0.7 seconds per pin for solder application is now possible. This achieves a 60% reduction in cycle time compared to wire soldering and spot lasers. ◆ Labor-saving Non-contact operation allows for implementation in narrow spaces where the soldering tip cannot reach, without putting stress on the circuit board or terminals. Maintenance such as cleaning or replacing the soldering tip is unnecessary, facilitating automation through continuous operation. ◆ Energy-saving Since no soldering tip is used, the cost of consumables is reduced. Additionally, compared to solder baths and reflow ovens, there is no need for constant heating, allowing for savings on electricity costs. ◆ Enhanced customization capability We cater to various needs such as product size, weight, flow direction, and appearance inspection.
basic information
【Specifications】 Equipment Size: 1,400mm × 950mm × 1,650mm Equipment Weight: 1,500kg Coating Specification: Screw-type coating dispenser / Drip prevention function Laser Rated Output: Maximum 130W
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Applications/Examples of results
THD components/terminals are mounted using multi-point simultaneous soldering with solder paste and area laser.