There are various baths for copper plating, but what are the characteristics of each?
What are the characteristics of the various baths for copper plating at Silvec?
Q: There are various baths for copper plating; what are the characteristics of each? A: Copper sulfate plating: This plating has high smoothness for decorative purposes, allowing it to mask minor scratches and achieve a mirror finish. It is also used for circuit formation in printed circuit boards. Cyanide copper plating: This plating solution contains highly toxic cyanide, and its use has gradually decreased. However, it is an alkaline plating solution with excellent uniform electrodeposition, strong adhesion to impurities, and is essential for plating on zinc alloys. Pyrophosphate copper plating: This plating solution has become popular as an alternative to cyanide copper plating. It has excellent uniform electrodeposition and is suitable for carburizing prevention and electroforming, but its use has decreased due to the difficulty of wastewater treatment (copper removal).
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