Is nickel plating effective for preventing metal diffusion when applied over a tin-plated base?
Is it true that applying nickel plating over tin plating is effective in preventing metal diffusion into electronic components such as contacts and connectors?
Q: Is it true that nickel plating on a tin-plated substrate is effective in preventing metal diffusion into electronic components such as contacts and connectors? A: Yes, it is effective. For example, by inserting a nickel plating between copper plating and tin plating, the nickel plating layer can act as a barrier to prevent copper diffusion into the tin plating layer.
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