If you apply nickel plating over a tin-plated base, can it prevent metal diffusion?
Q: Is it true that nickel plating on a tin-plated base is effective in preventing metal diffusion into electronic components such as contacts and connectors?
Q: Is it true that nickel plating on a tin-plated base is effective in preventing metal diffusion into electronic components such as contacts and connectors? A: Yes, it is effective. For example, by placing a nickel plating between copper plating and tin plating, the nickel plating can act as a barrier to prevent copper diffusion into the tin plating.
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If you are having trouble with whisker issues, we would appreciate it if you could consider our solderable nickel plating (developed exclusively by Silvec), which has solder wetting properties equivalent to zinc plating. If you have any questions, please feel free to contact us. 【Contact Information】 TEL: 048-994-5931 FAX: 048-994-5935 E-mail: info@silvec.co.jp
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