Shinko Manufacturing Co., Ltd. Business Introduction
"Polish and Cut" Precision Processing Professionals - Shinko Seisakusho Co., Ltd.
○ Cutting Processing of Materials Shinko Seisakusho began mass production processing using a fixed abrasive method in 2009 and owns a fixed abrasive wire saw for cutting silicon wafers for solar cells. Currently, it achieves a processing yield of over 96% and mass-produces more than 4 million silicon wafers per month. ○ Polishing and Lapping Processing Polishing processing is a method that further flattens and finishes the lapped surface formed during lapping processing to a mirror finish. It uses a soft polishing tool and employs fine particles (micron, sub-micron) as abrasives. ○ Material Development - Single Crystal SiC In 2010, marking the 50th anniversary of its founding, the company started its own material development. Utilizing its technology to handle materials supplied by clients, it aims to focus on developing its own brand of materials in the future. As the first step, it has developed single crystal SiC material, with plans to sell SiC wafers in sight.
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【Factory】 A group of factories established with the highest priority on harmony with the natural environment. Each factory operates in an organized manner, and we prioritize harmony with the natural environment. We have introduced wastewater treatment coagulation sedimentation filtration systems and have taken comprehensive measures for environmental conservation. ○ Ochiai Factory ○ Tsuyama Factory
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