Polishing Technology: Ultra-Precision Lapping Process
We accommodate a wide range of materials, including ceramics, metals, glass, and single crystals.
Wrapping processing refers to a method of free abrasive processing that involves performing a sliding motion (rubbing) while containing free abrasive particles (grinding agents), thereby polishing the workpiece by making minute cuts, resulting in a flatter finish on the workpiece. As a result, high-precision processing surfaces and dimensions can be achieved. Furthermore, a processing method has also been developed that fixes diamond abrasive particles to a metal flat plate as a machine for generating high-precision surfaces.
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【Factory】 A group of factories established with the highest priority on harmony with the natural environment. Each factory operates in an organized manner, and we prioritize harmony with the natural environment, having implemented wastewater treatment coagulation sedimentation filtration systems to ensure comprehensive environmental conservation measures. ○ Ochiai Factory ○ Tsuyama Factory
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Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!