Shinko Manufacturing Co., Ltd. Company Profile
A group of engineers specializing in ultra-precision machining! Leave ultra-precision cutting and grinding processing to us!
Shinko Seisakusho Co., Ltd. offers cutting and polishing technologies as professionals in ultra-precision machining and polishing. With ultra-precision cutting using a multi-wire saw, it is possible to cut materials such as silicon carbide, silicon nitride, cemented carbide, and tungsten. Dicing of small pieces can process tens of thousands of units at once. Additionally, ultra-precision polishing through single-sided and double-sided polishing allows for mirror polishing of φ2mm small pieces, SiC single crystals, and ceramics, with small piece polishing capable of processing tens of thousands of units at once. 【Business Activities】 ■ Precision polishing of mechanical and electronic components ■ Precision cutting of mechanical and electronic components ■ Polishing of optical single crystals *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Equipment Owned (Excerpt)】 ■Single-Sided Grinding Machine ■Double-Sided Grinding Machine ■Single-Sided Polishing Machine ■Double-Sided Polishing Machine ■High-Speed Centrifugal Barrel Machine ■Multi-Wire Saw ■Band Saw ■Blade Saw ■Single Wire Saw ■Surface Grinding Machine *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
