[AI Image Inspection Case] Inspection of Silver Wire Glass
It determines the detection of defects and smudges in silver paste conductive bonding!
Sintering with silver paste causes less damage to the materials compared to soldering, and it can be said that this material will be used more widely in the future as a substitute for solder. 【Inspection Settings and Results】 By using the "Scratch and Defect Inspection" feature of EasyInspector, we were able to detect both chipping and smudging in 0.40 seconds by applying one inspection frame to the entire area. The size (resolution) per pixel is approximately 7μm (0.007mm). In actual operation, our "sm＠rtROBO" is used to move the inspection area while being inspected by a single camera. 【Software and Equipment Used】 Software Used: EasyInspector Field of View: 14 mm Minimum Size of Inspection Target: Approximately 7μm (0.007mm) Number of Inspection Points: 1 Camera Resolution: 5 million pixels Lens Focal Length: Not recorded Distance Between Lens and Product: 95mm Lighting: Backlight illumination The current 'EasyInspector2' color package can be used for [Scratch and Defect Detection].
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