Suntex Co., Ltd. Official site

Fanless Embedded PC IBASE AMS302

Fanless embedded PC with expansion slots, capable of mounting 7th/6th generation Core i7/i5/i3 CPUs for embedded systems.

Features ■ Width 275 × Height 117 × Depth 140 mm, 4.5 liters ■ 7th/6th generation Core i Desktop CPU, fanless operation ■ DDR4-2133 SO-DIMM, maximum 32GB ■ DVI-I x1, DP x1 output ■ 2 slots: PCI-E [x8] x1, PCI-E [x4] x1 ■ 2.5" SATA HDD x2, mSATA x1 ■ iSMART, iAMT (11.6) ■ Robust, vibration-resistant, cable-less structure ■ Remote power switch

Related Link - http://www.suntex.co.jp/ibase/ibase_pc.htm#ams300

basic information

Specifications ■CPU: Socket LGA1151 7th/6th Generation Core i7/i5/i3 Desktop ■Chipset: Q170PCH ■Memory: 4GB DDR4-2133 SO-DIMM x2 (maximum 32GB) ■CPU Board: MB300 ■Hard Disk: mSATA x1, 2.5" HDD x2 ■Expansion Slots: Mini PCI-E x 1, PCI-E[x8] x 1 + PCI-E[x4] x 1 ■I/O Connectors: G-LAN x2 USB3.0 x4, USB2.0 x2 RS-232 x1, RS-422/485 x1 DVI-I x1, DP x1 Audio Line out ■Input Power: DC 12–24V ■Case: Aluminum, Steel ■Dimensions: 275mm(W) x 117mm(H) x 140mm(D) ■Operating Temperature: -10–60℃ (with airflow) / -10–50℃ ■Certifications: CE, LVD, FCC Class B

Price information

Open price

Price range

P3

Delivery Time

P4

Model number/Brand name

IBASE AMS302

Applications/Examples of results

Machine, factory, building automation

Line up(2)

Model number overview
AMS302 7th/6th generation socket LGA1151 compatible with Core i CPUs, 4GB DDR4 x2, 2.5-inch 64GB industrial SSD, Mini PCI-E x1, PCI-E[x8] x1, PCI-E[x4] x1
Options CPU (i7-6700TE, i5-6500TE, i3-6100TE, G4400TE, G3900TE), AC adapter

IBASE AMS302 Mini PC Product Catalog

PRODUCT

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Distributors

Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.