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Embedded PC ADLINK MVP-5001/5002/5003

MVP Series for Embedded Systems, equipped with 6th generation Core i7/i5/i3.

■Width 220 × Height 121 × Depth 210 mm, 5.59 liters ■Core i7-6700TE/i5-6500TE/i3-6100TE CPU Fanless ■Memory DDR4 SO-DIMM (up to 32GB) ■Dual Display 1 VGA, 1 DVI & 2 DP ■Rich I/O 3 GbE, 4 USB3.0, 2 USB2.0, 4 COM ■Robust, vibration-resistant, cableless structure ■Wide DC input 12V to 24V ■DIO Isolated 8 DI + 8 DO

MVP-5001/5002/5003

basic information

■CPU Core i7-6700TE 2.4GHz (MVP-5001) Core i5-6500TE 2.3GHz (MVP-5002) Core i3-6100TE 2.7GHz (MVP-5003) ■Memory DDR4-2133MHz SODIMM x 2, Maximum 32GB ■Expansion Slots CFast x 1, PCIe mini card x 1 ■I/O Connectors GbE x 3 (RJ-45), USB3.0 x 4 + USB2.0 x 2, USB2.0 x 1 (internal), RS-232 x 2 (D-Sub9), RS-232/422/485 x 2 (D-Sub9), DisplayPort x 2, DVI-D x 1, VGA x 1, Audio Mic in, Line out, DIO isolated 8DI + 8DO ■Input Power DC 12-24V input (optional 160W AC adapter) ■Operating Temperature 0 - 50℃ ■Dimensions / Weight 220mm(W) x 121mm(H) x 210mm(D) / 3.6kg

Price information

Open price

Delivery Time

Model number/Brand name

MVP-5001/5002/5003

Applications/Examples of results

Machine control / Factory and building automation / IoT systems / Monitoring systems

Line up(7)

Model number overview
MVP-5001 Core i7-6700TE 2.4GHz CPU, 4GB DDR4 memory
MVP-5002 Core i5-6500TE 2.3GHz CPU, 4GB DDR4 memory
MVP-5003 Core i3-6100TE 2.7GHz CPU, 4GB DDR4 memory
Option Memory 8GB/16GB/32GB Upgrade
Option HDD 500GB/1TB (factory-installed option)
Option SSD MLC 64GB (factory-installed option)
Option 160W Industrial AC Adapter

Fanless Embedded PC ADLINK MVP-5001/5002/5003 Product Catalog

PRODUCT

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Distributors

Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.