Suntex Co., Ltd. Official site

Fanless Embedded PC IEI TANK-871-Q170

TANK series, equipped with Core i7-6700TE/i5-6500TE, for systems compatible with extended temperatures.

Features ■ Width 82.2 × Height 204 × Depth 255.2 mm ■ Fanless Core i7-6700TE 2.4GHz / i5-6500TE 2.3GHz CPU ■ Triple display (VGA, HDMI + DisplayPort, iDP) ■ Dual wide DC input 9V – 36V ■ Extended operating temperature -20 to 60℃ (with i5-6500TE and SSD) ■ Robust, vibration-resistant ■ IPMI 2.0 compliant with iRIS-2400 module

Related Link - http://www.suntex.co.jp/iei/iei_pc.htm#tank-870-q1…

basic information

Specifications ■CPU Core i7-6700TE 2.4GHz / i5-6500TE 2.3GHz / Q170 ■Memory DDR4-SODIMM x 2 (4GB, up to 64GB) ■Hard Disk 2.5" SATA HDD bays x2 ■Expansion Slots mSATA x1, Mini PCIe x1 (Half size) ■I/O Connectors 10/100/1000Base-T x 2, USB3.0 x 4, USB2.0 x 4, RS-232 x 4, RS-422/485 x 2, VGA x 1, HDMI+DisplayPort x 1, iDP x 1 ■Input Power Redundant dual DC input (9–36V) ■Dimensions/Weight 82.2mm(W) x 204mm(H) x 255.2mm(D) / 3.5kg ■Operating Temperature -20–45℃ (i7-6700TE, SSD) with airflow / -20–60℃ (i5-6500TE, SSD) with airflow ■Shock Half sine wave vibration 5G; 11ms; 100 axes ■Vibration MIL-STD-810G 514.6 C-1 (SSD)

Price information

Open price

Price range

P3

Delivery Time

P4

Model number/Brand name

IEI TANK-871-Q170

Applications/Examples of results

Factory and Building Automation / Multimedia Systems / Digital Signage

Line up(3)

Model number overview
TANK-871-Q170i-i5/4G-R10 Core i5-6500TE 2.3GHz, 4GB DDR4
TANK-871-Q170i-i7/4G-R10 Core i7-6700TE 2.4GHz, 4GB DDR4
Options 90W/120W AC adapter, iRIS-2400, DP-DP, DP-HDMI, DP-LVDS DP-GVA, DP-DVI, IPCIE-4POE

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Distributors

Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.