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Embedded PC IBASE AGS102

Embedded system equipped with Atom x7-E3950/x5-E3930/Pentium N4200/Celeron N3350 CPU.

Features ■ Width 160 × Height 44 × Depth 110 mm, 0.77 liters ■ Atom x7-E3950/x5-E3930/Pentium N4200/Celeron N3350 CPU ■ Fanless operation ■ DDR3L SO-DIMM, maximum 8GB ■ Extended temperature range -40℃ to 70℃ (E series CPU) / -20℃ to 60℃ (N series CPU) ■ DVI-I, DP output ■ Mini PCI-E x1, 2230 M.2 E-Key x1, 3042 M.2 B-Key x1 ■ mSATA x1, 2242 M.2 B-Key x1

IBASE AGS102

basic information

Specifications ■CPU: Atom x7-E3950/x5-E3930/ Pentium N4200/ Celeron N3350 ■Memory: DDR3L-1866 SO-DIMM x 1 (up to 8GB) ■Hard Disk: mSATA x 1, 2242 M.2 B-Key x1 ■Expansion Slots: Mini PCI-E[x1] x2 ■I/O Connectors: Mini PCI-E x1, 2230 M.2 E-Key x1, 3042 M.2 B-Key x1 G-LAN x2 (RJ-45), USB3.0 x4 (rear), USB2.0 x1 (rear), RS-232 x2 (D-Sub9) (rear), RS-422/485 x2 (D-Sub9) (side), DVI-I x1, DisplayPort x1 (rear), GPIO (4-in & 4-out) x1 Audio Line out (side) ■Input Power: DC 9–36V ■Case: Aluminum, Steel ■Dimensions: 160mm(W) x 44mm(H) x 110mm(D) ■Operating Temperature: 20–60℃ (N series CPU) / -40–70℃ (Atom E series CPU)

Price information

Open price

Price range

P3

Delivery Time

P4

Model number/Brand name

IBASE AGS102

Applications/Examples of results

For embedded systems

Line up(4)

Model number overview
AGS102-I50 Atom x7-E3950 CPU, 4GB DDR3L, mSATA 64GB industrial SSD, 4COM
AGS102-I30 Atom x5-E3930 CPU, 4GB DDR3L, mSATA 64GB industrial SSD, 4COM
AGS102-420 (MOQ) Pentium N4200 CPU, 4GB DDR3L, mSATA 64GB industrial SSD, 4COM
AGS102-335 Celeron N3350 CPU, 4GB DDR3L, mSATA 64GB industrial SSD, 4COM

Small PC IBASE AGS102 Product Catalog

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Distributors

Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.