Fanless Embedded PC IEI ITG-100-AL
ITG Series for small embedded systems, equipped with Atom x5-E3930.
Features ■ Width 137 × Height 45 × Depth 110.4 mm (ITG-100-AL-E1/S) 0.68 liters ■ Width 137 × Height 56.2 × Depth 110.4 mm (ITG-100-AL-E1) 0.85 liters ■ Atom x5-E3930 1.3GHz CPU Fanless ■ Ultra-compact size ■ Full-size PCIe Mini and M.2 a-key slot ■ Expandable I/O, supports 2.5" SATA HDD/SSD expansion ■ Operating temperature range -20 to 60℃ (with SSD installed)
basic information
Specifications ■ Atom x5-E3930 1.3GHz ■ Chipset SoC ■ Memory DDR3L SODIMM x 1 (up to 8GB) ■ Hard Disk 2.5" SATA HDD x 1 ■ Expansion Slot Mini PCIe Full size x 1 (mSATA), M.2 2230 x 1 (A key, PCIe by 1, USB2.0) ■ I/O Connectors 10/100/1000Base-T x2 (RJ-45), USB3.0 x2, RS-232/422/485 x 2, VGA x1 (D-Sub15) ■ Input Power 12VDC input ■ Dimensions/Weight ITG-100-AL-E1/S; 58.75mm(W) x 174mm(H) x 130mm(D) / 1.4kg ITG-100-AL-E1; 137mm(W) x 56.2mm(H) x 102.8mm(D) / 860g ■ Operating Temperature -20 to 60℃ (when using extended temperature SSD) ■ Shock Half sine wave vibration 5G; 11ms; 100 axes ■ Vibration MIL-STD-810G 514.6 C-1 (SSD) ■ Certification CE, FCC
Price information
Open price
Delivery Time
Model number/Brand name
ITG-100-AL
Applications/Examples of results
Factory and Building Automation / Multimedia Systems / Digital Signage
Line up（4）
| Model number | overview |
|---|---|
| ITG-100-AL-E1/S-R10 | Atom x5-E3930 1.3GHz |
| ITG-100-AL-E1/2GB/S-R10 | Atom x5-E3930 1.3GHz, 2GB DDR3L |
| ITG-100-AL-E1-R10 | Atom x5-E3930 1.3GHz, Flexible I/O Expansion |
| ITG-100-AL-E1/2GB-R10 | Atom x5-E3930 1.3GHz, 2GB DDR3L, Flexible I/O Expansion |
Recommended products
Distributors
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.