Suntex Co., Ltd. Official site

Fanless Embedded PC IEI FLEX-BX200-Q370

FLEX series, equipped with Core i3-8100T and Pentium Gold G5400T, designed for systems supporting extended temperature.

Features ■ Width 357 × Height 88 × Depth 230 mm, 7.23 liters ■ Core i3-8100T / Pentium Gold G5400T 3.1GHz CPU ■ Chipset Q370 ■ PCIe 3.0 [x8] x 2, PCIe 3.0 [x4] x 2 ■ 2.5" SATA HDD bays (Hot-Swappable) x 4 ■ M.2 2280 (supports PCIe Gen 3.0 x4 NVMe SSD) x 2 ■ Operating temperature range -20 to 50℃ (with SSD) ■ Wall/Rack mount compatible

Related Link - https://suntex.co.jp/iei/iei_pc.htm#flex-bx200-q37…

basic information

Specifications ■CPU Core i3-8100T 3.1GHz / Pentium Gold G5400T 3.1GHz ■Chipset Q370 ■Memory 288pin DDR4 2666/2400 MHz U-DIMM x 2 (up to 64GB) ■Storage 2.5" SATA HDD bays x 4 ■Expansion Slots PCIe3.0[x8] x 2, PCIe3.0[x4] x 2 (Supported size: 68 x 167mm (maximum)) M.2 2280 (PCIe3.0[x4] NVMe SSD) x 2 ■I/O Connectors 10/100/1000Base-T x 2 (RJ-45), USB3.0 x 6, RS-232 x 2, HDMI x 1, Audio Mic In / Line out ■Input Power ATX 250W AC input 115~230V ■Dimensions/Weight 357mm(W) x 88mm(H) x 230mm(D) / 4kg ■Operating Temperature -20 to 50℃ (Extended temperature when using SSD) ■Shock 10G (11ms) ■Vibration 1.5G

Price information

Open price

Delivery Time

Model number/Brand name

FLEX-BX200-Q370

Applications/Examples of results

Factory and Building Automation / Multimedia Systems / Digital Signage

Line up(2)

Model number overview
FLEX-BX200-Q370-i3/25-R10 Core i3-8100T 3.1GHz
FLEX-BX200-Q370-P/25-R10 Pentium Gold G5400T 3.1GHz

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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.