Suntex Co., Ltd. Official site

Embedded PC IEI RACK-500AI-C246

Equipped with the 8th generation Xeon E-2176G for AI systems.

Features ■ Width 440.2 × Height 110.6 × Depth 221.3 mm, 10.77 liters ■ Xeon E-2176G 3.7GHz CPU (RACK-500AI-C246) ■ Capable of mounting AI accelerator cards (Mustang series) ■ PCIe [x16] x 1, PCIe [x4] x 1 ■ 3.5" SATA HDD bay (Hot Swap) x 1 ■ 2280 M key (PCIe [x4]) x 1 ■ Extended operating temperature -20 to 50℃

Related Link - https://suntex.co.jp/iei/iei_pc.htm#rack-500ai-c24…

basic information

Specifications ■CPU/Chipset: Xeon E-2176G 3.7GHz / C246 ■Memory: 16GB ECC DDR4 2666 MHz ECC (installed), ECC & non-ECC SDRAM x 2 (maximum 64GB) ■Storage: 3.5" SATA HDD bay x 1 (Hot swap) ■Expansion Slots: PCIe[x16] x 1, PCIe[x4] x 1, 2280 M key (PCIe[x4]) x 1 ■I/O Connectors: 10/100/1000Base-T x 2 (RJ-45), USB3.2 x 2, USB2.0 x 6 (internal), RS-422/485 x 1, RS-232 x 3 (internal), HDMI x 1, DisplayPort x 1 (internal) ■Input Power: ATX 350W AC input ■Dimensions/Weight: 440.2mm(W) x 110.6mm(H) x 221.3mm(D) / 8kg ■Operating Temperature: -20 to 50℃ ■Shock Resistance: Half sine wave vibration 5G; 11ms; 100 axes

Price information

Open price

Price range

P3

Delivery Time

P4

Model number/Brand name

IEI RACK-500AI-C246

Applications/Examples of results

Embedded for AI systems

Line up(2)

Model number overview
RACK-500AI-C246-XE/16G/35-R10 Xeon E-2176G 3.7GHz, 16GB ECC DDR4
RACK-500AI-C246-35-R10 Barebone

Small PC IEI RACK-500AI-C246/PAC-400AI-C236 Product Catalog

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Distributors

Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.