Embedded PC Vecow SPC-5200
For small embedded systems, equipped with an 8th generation CPU, supporting extended temperature range.
Features ■ Width 227.4 × Height 44 × Depth 106.2 mm, 1.06 liters ■ 8th generation Core i7/i5/Celeron CPU (Whiskey Lake), fanless operation ■ DDR4-2400MHz (up to 32GB) ■ 4K resolution support, 2 independent display outputs ■ 2 GbE, 2 COM (SPC-5000/5100) ■ 2 GbE + 2 GbE PoE, 4 COM, 16 Isolated DIO ■ Extended temperature range -40 to 70℃ ■ Wide DC input 9 to 48V ■ Railway standard EN50155 certified
basic information
Specifications ■CPU/Chipset: 8th Generation Core i7-8665UE/i5-8365UE/i3-8145UE/Celeron 4305UE (Whiskey Lake) / SoC (Cannon Lake) ■Memory: DDR4-2400MHz SO-DIMM x1 (up to 32GB) ■Expansion Slot: Mini PCIe x 1 (1 PCIe/USB/mSATA (optional)) ■Storage: 2.5" HDD/SSD x1 ■I/O Connectors: GigE LAN x2, USB3.1 x4, RS-232/422/485 x4, DisplayPort x1, DVI-D x1, Isolated DIO (8 DI, 8 DO) x 1, Audio Line-out ■Input Power: DC 9–48V, Remote Switch ■Operating Temperature: -40–70℃ ■Dimensions (mm)/Weight (kg): 227.4(W)x44(H)x106.2(L) / 1
Price information
Open price
Delivery Time
Model number/Brand name
Vecow SPC-5200
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
Line up（4）
| Model number | overview |
|---|---|
| SPC-5200-8665U | Core i7-8665UE, 2 GigE + 2 GigE PoE, Isolated DIO(8 DI, 8 DO), -40 ～ 70℃ |
| SPC-5200-8365U | Core i5-8365UE, 2 GigE + 2 GigE PoE, Isolated DIO(8 DI, 8 DO), -40 ～ 70℃ |
| SPC-5200-8145U | Core i3-8145UE, 2 GigE + 2 GigE PoE, Isolated DIO(8 DI, 8 DO), -40 ～ 70℃ |
| SPC-5200-4305U | Celeron 4305UE, 2 GigE + 2 GigE PoE, Isolated DIO(8 DI, 8 DO), -40 ～ 70℃ |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.