Fanless Embedded PC IBASE AMI230
Compatible with embedded systems, capable of mounting 9th/8th generation Core i7/i5/i3 CPUs.
Features ■ Width 210 × Height 77 × Depth 285 mm, 4.61 liters ■ Fanless system equipped with IBASE MB230 customized board ■ 9th/8th generation Core i7/i5/i3 Desktop CPU ■ DDR4-2666/2400 SO-DIMM, up to 32GB ■ Dual SIM slot supporting WWAN redundancy ■ 4x RJ45 Gigabit Ethernet ports (2x 802.3at PoE+ compatible) ■ 3x M.2 (B-Key/E-Key/M-Key) ■ Overvoltage/undervoltage/reverse voltage protection ■ iSMART, iAMT (11.6), TPM 2.0 ■ Rugged, vibration-resistant, cableless design ■ Remote power switch
basic information
Specifications ■CPU/Chipset: Socket: LGA1151 9th/8th Gen Core i7/i5/i3 Desktop / Q370 PCH ■Memory: DDR4-2666/2400 SO-DIMM x 2 (up to 32GB) ■CPU Board: MB230AF/MB230AF-P ■Hard Disk: M.2 (1 B-Key, 1 M-Key (NVMe)) x 2, 2.5" HDD/SSD x 1 ■Expansion Slots: M.2 (E-Key) x 1, SIM Card x 2 ■I/O Connectors: GbE x 2 (RJ-45), GbE (PoE+) x 2 (RJ-45), USB3.1 x 8, RS-232 x 2 (D-Sub9), RS-232/422/485 x 2 (D-Sub9), DVI-D x 1, HDMI x 1, DP x 1 ■Input Power: DC 12V / 18–24V ■Case: Aluminum, Steel ■Dimensions (mm): 210(W) x 77(H) x 285(L) ■Weight: 4kg ■Operating Temperature: -20–70℃ ■Certification: CE, LVD, FCC Class A
Price information
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Model number/Brand name
IBASE AMI230
Applications/Examples of results
For embedded systems
Line up（2）
| Model number | overview |
|---|---|
| AMI230AF | Supports 9th/8th generation LGA1151 socket Core i CPUs, 8GB DDR4 x1, 2.5inch 64GB industrial SSD, compatible with SIERRA (4G) module |
| AMI230AF-P | Supports 9th/8th generation LGA1151 socket Core i CPUs, 8GB DDR4 x1, 2.5 |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.