Fanless Embedded PC ADLINK MVP-5100
MVP Series for Embedded Systems, equipped with 9th generation Core i7/i5/i3.
Features ■ Width 210 × Height 86 × Depth 240 mm, 4.33 liters ■ Fanless Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE/Celeron G4900T CPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++ 1.2, VGA, DVI ■ Abundant I/O 3 GbE, 3 USB3.1, 4 USB2.0, 4 COM ■ Robust, vibration-resistant, cableless structure ■ Wide DC input 12V to 24V ■ DIO 8 DI + 8 DO
basic information
Specifications ■CPU: Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE/Celeron G4900T ■Chipset: H310 (Option: C246) ■Memory: DDR4-2400MHz SODIMM x 2, Maximum 32GB ■Storage: SATA-III 2.5" HDD/SSD x 2 ■Expansion Slots: CFast (Type II) x 1, PCIe mini card x 1 ■I/O Connectors: GbE x 3 (RJ-45), USB3.1 x 3 + USB2.0 x 3, USB2.0 x 1 (internal), RS-232 x 2 (D-Sub9), RS-232/422/485 x 2 (D-Sub9), DP++ x 2, DVI-D x 1, VGA x 1, Audio Mic in, Line out, DIO 8DI + 8DO ■Input Power: DC 12-24V input ■Dimensions / Weight: 210mm (W) x 86mm (H) x 240mm (D) / 4.1kg ■Operating Temperature: 0 to 50℃
Price information
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Delivery Time
Model number/Brand name
MVP-5100
Applications/Examples of results
In-vehicle multimedia / machine control / factory and building automation / monitoring systems
Line up（5）
| Model number | overview |
|---|---|
| MVP-510A | Core i7-9700E 2.6GHz CPU, 4GB DDR4 memory |
| MVP-5101 | Core i7-9700TE 1.8GHz CPU, 4GB DDR4 memory |
| MVP-5102 | Core i5-9500TE 2.2GHz CPU, 4GB DDR4 memory |
| MVP-5103 | Core i3-9100TE 2.2GHz CPU, 4GB DDR4 memory |
| MVP-5104 | Celeron G4900T 2.9GHz CPU, 4GB DDR4 memory |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.