Suntex Co., Ltd. Official site

ADLINK GPU Card EGX-MXM-RTX5000

NVIDIA(R) Quadro(R) RTX5000 GPU equipped, mobile PCI Express graphics module

**Features** - Quadro(R) RTX5000 Embedded Graphics - 3072 CUDA(R) cores, 48 RT cores, 384 Tensor cores - 9.4 TFLOPS peak FP32 performance - Memory: 16GB GDDR6, 256-bit, bandwidth: up to 448GB/s - Interface: MXM 3.1, PCI Express Gen3 [x16] - Form factor: Standard MXM 3.1 Type-B+ (82 x 110 mm) - Display output: 4x DisplayPort 1.4b digital video output (4K @120Hz, 8K @60Hz) - Low power consumption: 110W TGP - 5 years of availability

Related Link - https://www.suntex.co.jp/adlink/index.htm

basic information

【Specifications】 ■Graphic Core ・GPU: Quadro(R) RTX5000 ・Memory: 16GB GDDR6, 256-bit, Bandwidth: Up to 448GB/s ■GPGPU Computing ・CUDA Cores: 3072 CUDA(R) Cores, 9.4 TFLOPS Peak FP32 Performance ・Tensor Cores: 384 ・Compute API: CUDA Toolkit 8.0, CUDA Compute Ver 6.1, OpenCL 1.2 ・Graphics API: DirectX(R) 12, OpenGL 4.6, Vulkan 1.0 API ■Others ・Dimensions: 82(W) x 110(D) x 4.8(H) mm ・Interface: MXM 3.1, PCI Express Gen3 [x16] ・Form Factor: Standard MXM 3.1 Type-B+ (82 x 110 mm) ・Operating Temperature: 0 to 55℃ (Standard), TBC (ETT) ・Storage Temperature: -40 to 85℃ ・Module Power Consumption: 110W TGP ・Supported OS: Windows 10 and Linux drivers, 64-bit

Price information

Open price

Delivery Time

Model number/Brand name

ADLINK EGX-MXM-RTX5000

Applications/Examples of results

Processing of Deep Learning and real-time ray tracing.

Line up(1)

Model number overview
EGX-MXM-RTX5000 NVIDIA(R) Quadro(R) RTX5000 Embedded Graphics, MXM 3.1 type B+, 82 x 110mm, PCIe x16 Gen3

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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.