Suntex Co., Ltd. Official site

Fanless Embedded PC Vecow ECX-2400/2300PEG

Railway, vehicle-mounted, compatible with 10th generation CPU, capable of mounting PEG graphics card, supports extended temperature range.

Features ■ Width 260 × Height 104 × Depth 240 mm, 6.49 liters ■ 10th Generation Xeon/Core i9/i7/i5/i3 CPU (Comet Lake-S) ■ DDR4-2933MHz (up to 64GB) ■ Power supply to graphics card up to 250W ■ 1 VGA, 1 DVI-D, 2 DP (supports 4K resolution), 4 independent display outputs ■ PCIe expansion features: 1 PCIe [x16], 1 PCIe [x4] ■ Expansion features: 1 M.2 KeyB, 1 M.2 KeyE, 2 Mini PCIe ■ 4 front-accessible 2.5" HDDs ■ 6 USB3.2, 1 USB2.0, 4 COM, 3 SIM Card ■ 2GbE / 2GbE + 4 PoE ■ Extended temperature support -20 to 45°C ■ Wide DC input 12 to 50V ■ Software-controlled ignition key ■ Railway standard EN50155 certified

Related Link - http://suntex.co.jp/vecow/vecow_pc.htm#ecx-2400peg

basic information

Specifications ■CPU/Chipset: 10th Generation Xeon/Core i9/i7/i5/i3 (Comet Lake-S)/W480E ■Memory: DDR4-2933MHz SO-DIMM x2 (up to 64GB) ■Expansion Slots: PCIe [x16] x1, PCIe [x4] x1, M.2 x2 (Key B+E), Mini PCIe x2 ■Storage: 2.5" HDD/SSD x4 (SATA3) (front access), mSATA x2, M.2 (Key M) ■I/O Connectors: GigE (iAMT) x1, GigE x1, GigE (PoE+) x4 (ECX-2400 PEG) USB 3.2 x6, USB 2.0 x1, RS-232/422/485 (ESD 8KV) x4, VGA x1, DVI-D x1, DP x2 Isolated DIO (16DI, 16DO) x1 (ECX-2400 PEG)/16 GPIO x1 (ECX-2300 PEG), Audio Mic-in, Line-out ■Input Power: DC 12–50V input (3-pin terminal block: On, Off, IGN) ■Operating Temperature: -20–45℃ ■Dimensions (WxHxL)/Weight: 260 x 104 x 240 mm / 5.5 kg

Price information

Open price

Delivery Time

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It may vary depending on the quantity and timing, so please feel free to contact us.

Model number/Brand name

Vecow ECX-2400/2300 PEG

Applications/Examples of results

Railway, onboard, machine/factory/building automation/surveillance systems.

Line up(19)

Model number overview
ECX-2400 PEG 6 GigE LAN (4 PoE+), Isolated DIO, 1 PCIe[x16] + 1PCIe[x4]
ECX-2400F PEG 6 GigE LAN (4 PoE+), Isolated DIO, 1 PCIe[x16] + 1PCIe[x4], FAN sink (supports 95W TDP CPU)
ECX-2300 PEG 2 GigE LAN, 16 GPIO, 1 PCIe[x16] + 1PCIe[x4]
ECX-2300F PEG 2 GigE LAN, 16 GPIO, 1 PCIe[x16] + 1PCIe[x4], FAN sink (supports 95W TDP CPU)
CPU Xeon W-1290E 10th Gen Xeon W-1290E (20M Cache, 4.8GHz, 95W TDP, supports ECC memory)
CPU Xeon W-1290TE 10th Gen Xeon W-1290TE (20M Cache, 4.5GHz, 35W TDP, supports ECC memory)
CPU Xeon W-1270E 10th Gen Xeon W-1270E (16M Cache, 4.8GHz, 80W TDP, supports ECC memory)
CPU Xeon W-1270TE 10th Gen Xeon W-1270TE (16M Cache, 4.4GHz, 35W TDP, supports ECC memory)
CPU Xeon W-1250E 10th Gen Xeon W-1250E (12M Cache, 4.7GHz, 80W TDP, supports ECC memory)
CPU Xeon W-1250TE 10th Gen Xeon W-1250TE (12M Cache, 3.8GHz, 35W TDP, supports ECC memory)
CPU Core i9-10900E 10th Gen Core i9-10900E (20M Cache, 4.7GHz, 65W TDP)
CPU Core i9-10900TE 10th Gen Core i9-10900E (20M Cache, 4.7GHz, 65W TDP)
CPU Core i7-10700E 10th Gen Core i7-10700E (16M Cache, 4.5GHz, 65W TDP)
CPU Core i7-10700TE 10th Gen Core i7-10700TE (16M Cache, 4.4GHz, 35W TDP)
CPU Core i5-10500E 10th Gen Core i5-10500E (12M Cache, 4.2GHz, 65W TDP)
CPU Core i5-10500TE 10th Gen Core i5-10500TE (12M Cache, 3.7GHz, 35W TDP)
CPU Core i3-10100E 10th Gen Core i3-10100E (6M Cache, 3.8GHz, 65W TDP, supports ECC memory)
CPU Core i3-10100TE 10th Gen Core i3-10100TE (6M Cache, 3.6GHz, 35W TDP, supports ECC memory)
Options 280W/160W Industrial AC Adapter, VESA Mount Kit, DIN-RAIL Kit, DDR4 Memory (4GB/8GB/16GB/32GB)

Embedded PC Vecow ECX-2400/2300 PEG Product Catalog

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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.