Fanless Embedded PC Arestech BPC-5070-1A1
For embedded systems, Intel Core i LGA1151 CPU up to 3.4 GHz, quad-core, fanless operation.
Features ■238 x 61 x 245 mm ■Intel Core i LGA1151 CPU ■Dual channel functionality ■DDR4 2133 MHz SDRAM, up to 32GB ■Mini PCIe 1x Full Size (PCIe x1, SATA III (mSATA), & USB 2.0), 1x Half Size (PCIe x1 & USB 2.0) expansion slots ■3x HDMI (4096 x 2160) ■Supports wall mounting ■Wide operating temperature range -20˚C ~ 60˚C
basic information
Specifications ■CPU: Intel Core i LGA1151 CPU ■Chipset: Intel Q170 ■Display: Intel Gen9 Graphics DX 11/12, OGL 4.3/4.4 (Graphics Engine), 3x HDMI (4096 x 2160), VGA (1920x1200) ■Front I/O Interface: 4x USB 2.0, 2x RS-232/422/485 ■Rear I/O Interface: 4x USB 3.0, 2x GbE (LAN 1: Intel I219LM, LAN 2: Intel I210), Line Out, Mic In (Realtek ALC887/897 HD), 2x Antenna Holes ■Expansion Slot: Mini PCIe 1x Full Size (PCIe x1, SATA III (mSATA), & USB 2.0) ■Operating Temperature: -20~60° C ■Dimensions/Weight: 238 x 61 x 245 mm / 3 kg ■Compatible with Windows 7/8.1/10, WES7-E/P, Ubuntu 14.04
Price information
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Model number/Brand name
Arestech BPC-5070-1A1
Applications/Examples of results
Factory, machinery, etc.
Line up（2）
| Model number | overview |
|---|---|
| BPC-5070-1A1 | Intel Core i LGA1151 CPU, Q170, 4x USB3.0, 4x USB2.0, 2x RS-232/422/485, 2x GbE, 3x HDMI, 1x VGA, RAID 0/1, DC 12/19~24V, Phoenix Connector |
| BPC-5070-2A1 | Intel Core i LGA1151 CPU, H110, 4x USB3.0, 4x USB2.0, 2x RS-232/422/485, 2x GbE, 2x HDMI, 1x VGA, DC 12/19~24V, Phoenix Connector |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.