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SECO SMARC CPU Module SWAN (SM-D16)

NXP i.MX 8X Family, ARM Cortex-A35, size 50x82mm

Features ■ Equipped with NXP i.MX 8X Plus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting two independent displays ■ Onboard LPDDR4-2400 with up to 4GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Android

Santex Corporation

basic information

Specifications ■CPU - NXP i.MX 8X family SoC: Real-time processing with dual or quad ARM Cortex-A35 cores + 1x Cortex M4F core - NXP i.MX8 QuadXplus: Real-time processing with 4x ARM Cortex-A35 cores + 1x Cortex M4F core - NXP i.MX8 DualXplus: Real-time processing with 2x ARM Cortex-A35 cores + 1x Cortex M4F core - NXP i.MX8 DualX: 2x ARM Cortex-A35 cores ■Memory Onboard LPDDR4-2400, up to 4GB ■I/O Interface 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; QuadSPI interface ... ■Operating Temperature 0 to 60°C (Optional: -40°C to 85°C) ■Dimensions: 50 x 82 mm (1.97” x 3.23”)

Price range

Delivery Time

Please contact us for details

The delivery time may vary depending on the quantity, so please feel free to contact us.

Model number/Brand name

SECO SWAN (formerly codenamed SM-D16)

Applications/Examples of results

Factory and Building Automation / Control Systems / Communication Systems / Monitoring Systems

SECO SMARC CPU Module SWAN Product Catalog

PRODUCT

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Distributors

Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.