Fanless Compact Embedded PC Kingdy CB104SD
CB Series equipped with the 11th generation Core i3-1115G4E CPU for gateway systems.
Features ■ Width 185 × Height 110 × Depth 76 mm, 1.55 liters ■ Fanless, compact chassis ■ Core i3-1115G4E CPU ■ 4 USB3.2, 2 USB2.0, 4 RS232/RS422/RS485, 2 GLAN ■ 1 HDMI, 1 DP ■ 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key ■ GPIO 16 bits ■ Wall mountable, DIN rail compatible ■ IIoT gateway application
basic information
Specifications ■CPU: Core i3-1115G4E Fanless CPU ■Memory: DDR4-3200 SODIMM x 2, Maximum 64GB ■H/W Monitor: Watch Dog Timer 256 Level ■Storage: 2.5" SATA HDD/SSD x 1, M.2 M Key 2280 x 1, M.2 B Key 2242/3042 x 1 ■I/O Connectors: USB3.2 x 4, USB2.0 x 2, RS232/422/485 x 4, GLAN x 2, HDMI x 1, DP x 1, GPIO (16 Bits (GPI x 8, GPO x 8), 5V, D-SUB x 2) ■Input Power: DC Input 12V–24V (2PIN Terminal Block) ■Case: Aluminum Alloy + Steel ■Mounting Method: DIN Rail ■Dimensions/Weight: 185(W) x 110(H) x 76(D) mm ■Operating Temperature: 0–50℃ (with airflow)
Price information
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Delivery Time
Model number/Brand name
Kingdy CB104SD04128
Applications/Examples of results
For embedded systems
Line up（8）
| Model number | overview |
|---|---|
| P/N: 2390000003 | external antenna (WIFI) |
| P/N: 3121700001 | 4GB LTE module with SIM socket |
| P/N: 308020000A | USB cable |
| P/N: 3080213001 | Line out & MIC in |
| CB103SD04128 | Celeron 6305E 1.8GHz, 4GB DDR4, TLC 128GB SSD, DIN rail |
| CB104SD04128 | Core i3-1115G4E 2.2GHz, 4GB DDR4, TLC 128GB SSD, DIN rail |
| CB105SD04128 | Core i5-1145G7E 1.5GHz, 4GB DDR4, TLC 128GB SSD, DIN rail |
| CB106SD04128 | Core i7-1185G7E 1.8GHz, 4GB DDR4, TLC 128GB SSD, DIN rail |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.