Suntex Co., Ltd. Official site

Fanless Embedded PC IEI FLEX-BX200-C246

2U size PC for AI systems, equipped with Xeon E-2176G.

Features ■ Width 357 × Height 88 × Depth 230 mm, 7.23 liters ■ Xeon E-2176G 3.7GHz CPU (FLEX-BX200-C246) ■ PCIe 3.0 [x8] x 2, PCIe 3.0 [x4] x 2 ■ 2.5" SATA HDD bays (Hot-Swappable) x 4 ■ M.2 2280 (supports PCIe Gen 3.0 x4 NVMe SSD) x 2 ■ QTS Gateway compatible

Related Link - https://suntex.co.jp/iei/iei_pc.htm#flex-bx200-q37…

basic information

Specifications ■CPU: Xeon E-2176G 3.7GHz/C246 ■Chipset: C246 ■Memory: 288pin DDR4 2666/2400 MHz ECC and non-ECC U-DIMM x 2 (maximum 64GB) ■Storage: 2.5" SATA HDD bays x 4 ■Expansion Slots: PCIe3.0[x8] x 2, PCIe3.0[x4] x 2 (Supported size: 68 x 167mm (maximum)) M.2 2280 (PCIe3.0[x4] NVMe SSD) x 2 ■I/O Connectors: 10/100/1000Base-T x 2 (RJ-45), USB3.0 x 6, RS-232 x 2, HDMI x 1, Audio Mic In / Line out ■Input Power: ATX 350W AC input 90~264V ■Dimensions/Weight: 357mm(W) x 88mm(H) x 230mm(D) / 4kg ■Operating Temperature: -20 to 40℃ (Extended temperature when using SSD) ■Shock: 10G (11ms) ■Vibration: 1.5G

Price information

Open price

Delivery Time

Model number/Brand name

IEI FLEX-BX200-C246

Applications/Examples of results

Factory and Building Automation / Multimedia Systems / Digital Signage

Line up(6)

Model number overview
FLEX-BX200AI-i5/35/V-R10 Core i5-8500, Pre-installed one of Mustang-V100, 350W PSU
FLEX-BX200-C246-XE/35-R10 Xeon E-2176G 3.7GHz, 350W PSU
FLEX-BX200-Q370-P/35-R10 Pentium Gold G5400T, 350W PSU
FLEX-BX200-Q370-i3/35-R10 Core i3-8100T, 350W PSU
FLEX-BX200-Q370-i5/35-R10 Core i5-8500T, 350W PSU
FLEX-BX200-Q370-i7/35-R10 Core i7-8700T, 350W PSU

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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.