Suntex Co., Ltd. Official site

Fanless Industrial Embedded PC Vecow ECX-3100

Railway and vehicle-mounted, compatible with 13th/12th generation CPUs, extended temperature support, fanless operation.

Features ■ Width 260 × Height 79 × Depth 240 mm ■ Equipped with 13th/12th generation Intel Core i9/i7/i5/i3 CPU ■ Supports up to 200W power supply for PCIe x16 expansion slot ■ 2× DDR5 4800MHz (up to 64GB) ■ Supports COM ports (RS-232/422/485) and 16 GPIO ■ Extended temperature range -40 to 75℃ (35W TDP CPU), -40 to 55℃ (65W TDP CPU) ■ Supports DC power input from 9V to 50V ■ Control via ignition key (16 modes) ■ Certified to railway standard EN50155

Santex Co., Ltd.

basic information

Specifications ■CPU/Chipset 13th/12th Generation Intel Core i9/i7/i5/i3 / Intel 600 Series Chipset ■Memory DDR5 4800MHz SO-DIMM x 2 (up to 64GB) ■Expansion Slots 1 Mini PCIe, 1 PCIe x16, 1 M.2 Key B (3042/2280), 1 M.2 Key B Socket (3052/2280), 1 M.2 Key E (2230) ■IO Interface 4×RS-232/422/485, 6×USB 3.2 Gen 2, 16 GPIO, 1×DVI-I, 2×HDMI, 2×DP ■Input Power DC 9–50V input ■Operating Temperature -25–55℃ (35W TDP CPU), -25–45℃ (65W TDP CPU) ■Dimensions (mm)/Weight (kg) 260mm(W) x 79mm(H) x 240mm(L) / 4.5kg ■Certifications: CE, FCC, EN50155, EN50121-3-2

Price information

Open price

Delivery Time

Please contact us for details

It may vary depending on the quantity and timing, so please feel free to contact us.

Model number/Brand name

Vecow ECX-3100

Applications/Examples of results

For machine, factory, and building automation/monitoring systems.

Industrial Extended Temperature Compatible Embedded PC Vecow ECX-3200/3100 Product Catalog

PRODUCT

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Distributors

Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.