Industrial Fanless Embedded PC Jetway HBFDF10
For industrial embedded systems, 11th generation Intel Core i5 CPU, extended temperature support, fanless operation.
Features ■ Width 193 × Height 62 × Depth 142.4 mm ■ Equipped with 11th generation Intel Core i5 CPU ■ Fanless operation ■ 2× DDR4-3200MHz SO-DIMM (up to 64GB) ■ 2 HDMI, 2 DP (Type-C) display outputs ■ Operating temperature range -20 to 50° C (when using M.2 interface SSD) ■ Expansion slots: M.2 E-key (2230) USB2.0/PCIex1, compatible with M.2 B-Key 3042/3052 ■ Supports 3× USB3.2 (Gen.2), 3× USB2.0
basic information
Specifications ■CPU: 11th Generation Intel Core i5-1145G7E (Default) CPU ■Memory: 2×DDR4-3200MHz SO-DIMM (Maximum 64GB) ■Expansion Slots: 1× M.2 E-key (2230) USB2.0/PCIex1, 1×M.2 B-Key 3042/30522 (USB3.1/USB2.0/PCIe x1) ■IO Interface: 2×HDMI, 2×DPP (Type-C), 3×USB3.2 (Gen.2), 3×USB2.0, 2×RJ45 ■Storage: 1×SATAIII (6Gb/s), M.2 M-key 2242/2280 ■Power: DC12_ 90W Adapter MB: DC12~24V ■Operating Temperature: -20 ~ 50° C (when using M.2 interface SSD), 0 ~ 50° C (when using 2.5” SATA HDD) ■Dimensions (mm): 193mm(W) x 62mm(H) x 142.4mm(L) ■Certifications: CE, FCC, LVD, RoHS
Price information
Open price
Delivery Time
Model number/Brand name
Jetway HBFDF10
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
Line up（4）
| Model number | overview |
|---|---|
| MF10-20 | CPU:i5-1145G7E |
| MF10-22 | CPU: i5-1145G7E / TPM2.0 |
| MF10-90 | CPU: i5-1135G7 |
| MF10-92 | CPU: i5-1135G7 / TPM2.0 |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.