Suntex Co., Ltd. Official site

Comet Lake CPU equipped embedded PC TANK-XM810

IEI, 2 2.5GbE, 6 USB3.2 + 2 USB2.0, 2 DP++, 1 HDMI, extended temperature -20ºC to 60ºC

**IEI TANK-XM810 Features** - Dimensions: 256.04mm (W) × 76.2mm (H) × 230.6mm (D), 4.5 liters - Fanless Comet Lake 10th Generation Core i7/i5/i3 CPU - 2 x 2.5GbE, 6 x USB3.2 + 2 x USB2.0 - 2 x DP++, 1 x HDMI - Expansion Slots (Optional) - 2 Slots: 1 x PCIe[x16] + 1 x PCIe[x4] / 2 x PCIe[x8] - 4 Slots: 1 x PCIe[x16] + 2 x PCIe[x4] + 1 x PCIe[x1] / 1 x PCIe[x16] + 1 x PCIe[x4] + 2 x PCI / 2 x PCIe[x8] + 2 x PCIe[x4] - 6 Slots: 2 x PCIe[x8] + 2 x PCIe[x4] - Dual Wide DC Input: 12V to 28V - Extended Operating Temperature: -20 to 60°C (CPU TDP 35W & SSD equipped) - Rugged, Vibration Resistant

Santex Co., Ltd. IEI Corporation Industrial PC List

basic information

Specifications ■CPU: 10th Generation Intel Core i7-10700TE 2GHz / i7-10700E 2.9GHz / i5-10500TE 2.3GHz / i5-10500 3.1GHz / i3-10320 3.8GHz ■Chipset: Q470/Q470E ■Memory: DDR4-3200 SODIMM x 2 (8GB installed, maximum 64GB) ■Storage: 2.5" SATA HDD/SSD bay x 1 ■I/O Interfaces: 2.5GbE x 2 (I225V)(RJ-45), USB3.2 x 6, USB2.0 x 2, RS-232 x 4, RS-232/422/485 x 2, DP++ x 1, HDMI x 1, DIO x 1 ■Input Power: 12–28VDC input (3pin), Remote PWR (2pin) ■Weight: 3.2kg ■Operating Temperature: -20–50℃ (CPU TDP 65W & SSD) with airflow / -20–60℃ (CPU TDP 35W & SSD) with airflow ■Certification: MIL-STD-810G 514.6 C-1 (SSD), CE, FCC, UKCA

Price information

Open price

Delivery Time

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Model number/Brand name

IEI TANK-XM810

Applications/Examples of results

For machine, factory, and building automation/monitoring systems.

Line up(7)

Model number overview
TANK-XM810-i3AC-R11 Core i3-10100TE 2.3GHz, 8GB DDR4
TANK-XM810-i3BC-R11 Core i3-10320 3.8GHz, 8GB DDR4
TANK-XM810-i5AC-R11 Core i5-10500TE 2.3GHz, 8GB DDR4
TANK-XM810-i5BC-R11 Core i5-10500 3.1GHz, 8GB DDR4
TANK-XM810-i7AC-R11 Core i7-10700TE 2GHz, 8GB DDR4
TANK-XM810-i7BC-R11 Core i7-10700E 2.9GHz, 8GB DDR4
Option 180W AC adapter, expansion fan, expansion board (8 2.5GbE PoE, 2 M.2 B-key & 1 M.2 A-key & 1 Mini PCIe), expansion backplane (2/4/6 expansion slots), 150W/380W power module for expansion slots, chassis for expansion backplane.

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