Suntex Co., Ltd. Official site

12th Generation CPU Equipped Mini PC BOXER-6751-ADP

AAEON, designed for embedded systems, equipped with Alder Lake 12th generation Intel Core i7/i5/i3, featuring fanless functionality.

Features ■ Width 74.3 × Height 127 × Depth 186 mm, 1.76 liters ■ Alder Lake Core i7-1265UE/i5-1245UE/i3-1215UE fanless CPU ■ 2 COM / 3 USB3.2 (Gen2) + 3 USB2.0 / 1 2.5GbE + 1 GbE ■ Operating temperature -20 to 60°C (with airflow) ■ 2 HDMI outputs ■ Wide DC input 9V to 36V ■ Case: made of aluminum ■ DIN rail mountable

Santex Corporation

basic information

Specifications ■CPU: Alder Lake Core i7-1265UE/i5-1245UE/i3-1215UE 2GHz CPU ■Memory: DDR4 SODIMM x 1, up to 32GB ■Expansion Slots: M.2 2280 M-Key x 1 (NVMe), M.2 2230 E-Key x 1 (Wi-Fi/BT), M.2 3052 B-Key w/ SIM x 1 (LTE/5G) ■I/O Connectors: 2.5GbE x 1, GbE x 1 (RJ-45), USB3.2 (Gen2) x 3, USB2.0 x 3, RS-232/422/485 x 2, HDMI x 2, Audio Line out x 1, DIO 8-bit x 1 (DB-15) ■Power Supply: DC input 9V–36V ■Dimensions/Weight: 74.3(W) x 127(H) x 186(D)mm / 1.77kg ■Operating Temperature: -20–60℃ (with airflow) ■Vibration Resistance: 3 grms ■Certification: CE/FCC class A ■Supported OS: Windows 10 IoT Ent LTSC, Windows 11 Pro, Ubuntu 22.04

Price information

Open price

Delivery Time

Model number/Brand name

AAEON BOXER-6751-ADP

Applications/Examples of results

For embedded systems

Line up(4)

Model number overview
BOXER-6751-ADP-A1-1010 Core i3-1215UE
BOXER-6751-ADP-A2-1010 Core i5-1245UE
BOXER-6751-ADP-A3-1010 Core i7-1265UE
Option AC Adapter (120W)

Alder Lake 12th Generation CPU Equipped Industrial Fanless Compact PC BOXER-6751-ADP Product Catalog

PRODUCT

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Distributors

Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.