Fanless Edge AI Computer for Automotive VC300-CS
DFI, equipped with 9th/8th generation CPU, AI Accelerated computing, fanless operation, supports extended temperature range.
Features ■ Width 340.5 × Height 132 × Depth 223 mm ■ Weight (kg) 9.85 kg ■ Equipped with Coffee Lake 9th/8th generation CPU ■ Chipset Intel Q370 Chipset ■ Dual Channel DDR4 2666/2400 MHz (up to 64GB) ■ Supports up to 150W GPU MXM module ■ Supports 4 x 802.3af 15W PoE ports, up to 15W ■ Maximum resolution 4K compatible with 3 independent display outputs (1 x VGA, 1 x HDMI, 1 x DP++) ■ 1 x Half-size Mini PCIe, 2 x Full-size Mini PCIe, 1 x M.2 B key 3042, 3052, 1 x M.2 2280 M key 2242, 2260 & 2280 expansion slots ■ Supports 2 x RJ45 GbE, 2 x High speed full RS-232/422/485 (DB-9), 2 x RS-232/422/485, 4 x USB 3.0, 2 x USB 2.0 ■ Mounting method Wall Mount
basic information
Specifications ■CPU: Intel Core i7-9700TE/i7-8700T/i7-9700E/i5-9500TE Processor ■Memory: Dual Channel DDR4 2666/2400 MHz (up to 64GB) ■Storage: 2 x 2.5 inch SSD storage bays (hot-swappable), 1 x M.2 2280 M key (supports SATA SSD) ■I/O Connectors: 2 x RJ45 GbE, 2 x High speed full RS-232/422/485 (DB-9), 2 x RS-232/422/485, 4 x USB 3.0, 2 x USB 2.0, 1 x VGA, 1 x HDMI, 1 x DP++ ■Input Power: +12VDC (9~36V), +24VDC (14.4~33.6) eMark compliant, with power ignition function and reverse polarity protection ■Operating Temperature: -05°C to 70°C (CPU+GPU<100W), -20°C to 60°C (CPU+GPU<160W), -20°C to 60°C (CPU+GPU<190W) ■Certifications: CE, FCC, UKCA, RoHS, E-Mark
Price information
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Model number/Brand name
DFI VC300-CS
Applications/Examples of results
Machine, factory, building automation/monitoring systems.
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.