NXP i.MX93 OSM CPU Module OSM-IMX93
ADLINK, NXP i.MX 93 with 2-core Arm Cortex-A55 & M33, LPDDR4L up to 2GB
【ADLINK OSM-IMX93 Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX93 series (2-core Arm Cortex-A55 + M33) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■Supports Arm Ethos U-65 micro NPU ■Supports independent display via 1x MIPI DSI ■LPDDR4L up to 2GB ■3x USB 2.0, 1x USB 2.0, 4x UART, 2x CAN2.0, 2x SPI, 1x I²S interface, 2x I2C interfaces, 16x GPIO ■Dual GbE (one port supports TSN) ■Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
basic information
Specifications ■CPU: ・NXP i.MX93 series (2-core Arm Cortex-A55 + M33) ・Armv8 cryptographic feature supported with TrustZone technology ・Arm Ethos U-65 micro NPU included ■Memory: LPDDR4L up to 2GB ■Ethernet: Dual GbE (one port supports TSN) ■Interfaces: 3x USB 2.0, 1x USB 2.0, 4x UART, 2x CAN2.0, 2x SPI, 1x I²S interface, 2x I2C interfaces, 16x GPIO, 1x MIPI DSI ■Power: 5V DC ■Operating temperature: 0°C to 60°C ■Dimensions: 45mm x 45mm
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Model number/Brand name
ADLINK OSM-IMX93
Applications/Examples of results
Factory and Building Automation / Control Systems / Communication Systems / Monitoring Systems
Line up（3）
| Model number | overview |
|---|---|
| OSM-iMX93-2G-32G-CT | OSM Size-L module with NXP i.MX 93 SoC, microNPU, 2GB LPDDR4, 32GB eMMC, 0°C ～ 60°C |
| OSM-iMX93-2G-32G-ER | OSM Size-L module with NXP i.MX 93 SoC, microNPU, 2GB LPDDR4, 32GB eMMC, -40°C ～ 85°C |
| OSM-iMX93-2G-32G-BW-CT | OSM Size-L module with NXP i.MX 93 SoC, microNPU, 2GB LPDDR4, 32GB eMMC, AC Wi-Fi BT 5.1, 0°C to 60°C |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.