NXP i.MX95 OSM CPU module OSM-IMX95
NXP i.MX 95 with 6x Arm Cortex-A55, LPDDR4L up to 8GB, eMMC up to 128GB
**ADLINK OSM-IMX95 Features** - Dimensions: 45mm x 45mm - i.MX95 series (equipped with 4-core or 6-core Cortex-A55, Cortex-M7, and M33 MCU) - DSI and LVDS graphic output interfaces - LPDDR4L up to 8GB - eMMC up to 128GB - 1x USB 3.0, 1x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 4x I2C interfaces, 12x GPIO, 1x GEN3 single lane - Dual GbE (TSN compatible) - Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
basic information
Specifications ■CPU: - NXP i.MX93 series (2-core Arm Cortex-A55 + M33) - Equipped with TrustZone technology supporting Armv8 cryptographic features - Equipped with Arm Ethos U-65 micro NPU ■Memory: LPDDR4L up to 2GB ■Ethernet: Dual GbE (TSN compatible) ■Interfaces: 1x USB 3.0, 1x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 4x I2C interfaces, 12x GPIO, 1x GEN3 single lane ■Power: 5V DC ■Operating temperature: 0°C to 60°C ■Dimensions: 45mm x 45mm
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Model number/Brand name
ADLINK OSM-IMX95
Applications/Examples of results
Factory and Building Automation / Control Systems / Communication Systems / Monitoring Systems
Line up（2）
| Model number | overview |
|---|---|
| OSM-IMX95-H-4G-32G-CT | OSM module L size with i.MX95 SOC , NPU , 4 GB LPDDR4, 32 GB eMMC, 0°C ～ 70°C |
| OSM-IMX95-H-4G-32G-ER | OSM module L size with i.MX95 SOC , NPU , 4 GB LPDDR4, 32 GB eMMC, -40°C ～ 85°C |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.