OSM CPU Module ADLINK OSM-MTK520
MediaTek Genio 520 SoC with 2x Arm Cortex-A78＆6x A55,LPDDR5 16GB
**ADLINK OSM-MTK520 Features** ■ Dimensions: 45mm x 45mm ■ Equipped with MediaTek Genio 520 ■ MediaTek 8th Generation NPU (up to 10 TOPS AI computing performance) ■ Compliant with OSM Revision 1.2 ■ Graphic output interfaces: DisplayPort (DP), eDP, HDMI, LVDS, DSI ■ LPDDR5 up to 16GB ■ UFS up to 512GB ■ 1x USB 3.1, 2x USB 2.0, 1x USB 2.0 OTG, 4x UART, 3x SPI, 2x I2S, 2x I2C, 22x GPIOs ■ TSN-compatible MAC 10/100/1000 Mbps RGMII interface ■ Operating temperature range: -40°C to 85°C ■ Compliant with IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
basic information
Specifications ■CPU: MediaTek Genio 520 SoC with 2x Arm Cortex-A78 & 6x A55 ■Memory: LPDDR5 up to 16GB ■Storage: UFS up to 512GB ■Ethernet: TSN-compatible MAC 10/100/1000 Mbps RGMII interface ■Interfaces: 1x USB 3.1, 2x USB 2.0, 1x USB 2.0 OTG, 4x UART, 3x SPI, 2x I2S, 2x I2C, 22x GPIOs ■Power: 5V DC ■Operating Temperature: -40°C to 85°C ■Dimensions: 45mm x 45mm
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Model number/Brand name
ADLINK OSM-MTK520
Applications/Examples of results
Factory and building automation / control systems / communication systems / monitoring systems
Line up（2）
| Model number | overview |
|---|---|
| OSM-MTK520-4G-64G-CT | OSM module L size with 8 Core Genio 520, NPU, 4 GB LPDDR5, 64 GB UFS, 0°C to 60°C |
| OSM-MTK520-4G-64G-ER | OSM module L size with 8 Core Genio 520, NPU, 4 GB LPDDR5, 64 GB UFS, -40°C to 85°C |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.