N150 Equipped Fanless Compact Embedded PC SBOX-2625-SF
SINTRONES, equipped with Twin Lake Processor N150, extended temperature support, fanless ultra-compact embedded PC.
**[SINTRONES SBOX-2625-SF Features]** ■ Width 182 × Height 40 × Depth 106 mm ■ Equipped with Intel Twin Lake N150 4-core processor, fanless operation ■ 1x DDR5-4800 SO-DIMM (up to 16GB) ■ 4K resolution support, 2 display outputs (2 HDMI) ■ 1x M.2 3042/3052 Key B, 1x M.2 2230 Key E for Wi-Fi/BT expansion slot ■ 1x 2.5'' SATA SSD, 1x M.2 2242 Key B for SATA SSD ■ 2x 2.5GbE, 2x USB 3.2 Gen 1, 4x USB 2.0, 4x DI (DC 5-36V), 4x DO (DC 5V/100mA), 2x RS-232/422/485 ■ Fanless ultra-compact chassis suitable for installation in limited spaces ■ Operating temperature range -30 to 60℃ (with airflow) ■ Supports DIN rail, wall, and VESA mounting ■ CE, FCC Class A, UKCA, IEC/EN 62368-1
basic information
Specifications ■CPU: Intel Twin Lake N150, 4 cores, up to 3.60GHz ■Memory: 1xDDR5-4800 SO-DIMM (up to 16GB) ■Graphics: Intel Graphics ■Storage: 1x2.5'' SATA SSD, 1 x M.2 2242 Key B for SATA SSD ■I/O Connectors: 2x2.5GbE, 2 x USB 3.2 Gen 1, 4 x USB 2.0, 4 x DI (DC 5-36V), 4 x DO (DC 5V/100mA), 2 x RS-232/422/485, 2 HDMI ■Expansion Slots: M.2 Key B ×1, M.2 Key E ×1, 2.5-inch SATA SSD ×1 ■Weight: 0.7Kg ■Operating Temperature: -30 to 60℃ ■Power Supply: DC 9 to 36V ■Certifications: CE, FCC Class A, UKCA, IEC/EN 62368-1 ■OS: Windows 11 IoT Enterprise LTSC, Ubuntu 24.04 LTS
Price information
Open price
Delivery Time
Model number/Brand name
SINTRONES SBOX-2625-SF
Applications/Examples of results
For vehicle-mounted, machine, factory, and building automation/monitoring systems.
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.