PCD mold parts for semiconductors
Supporting semiconductor manufacturing with precision machining of high-hardness materials.
In the semiconductor industry, precise cutting of wafers and chips is required. In particular, the accuracy and quality of the cutting surface are crucial for improving yield. Improper cutting can lead to product defects and performance degradation. Our PCD mold components achieve precise cutting through microprocessing technology for high-hardness materials, contributing to the improvement of quality in semiconductor manufacturing. 【Application Scenarios】 - Cutting of wafers - Separation of chips - Processes requiring high-precision cutting 【Effects of Implementation】 - Improved cutting accuracy - Enhanced yield - Stabilization of product quality
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【Features】 - Fine processing of high hardness materials - Mass production of straight and round blades, fine R processing on blades - High wear resistance due to the use of PCD (polycrystalline diamond) - Processing of palm-sized parts - Capable of accommodating various shapes 【Our Strengths】 - Manufacturing and sales of high hardness and fine processing parts - Years of experience and proven track record - Customization to meet customer needs - Detailed information available on the company website - Support from the Suwa Region Manufacturing Promotion Organization
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The Suwa Region Manufacturing Promotion Organization is a support hub that promotes industrial revitalization on a wide-area and cross-regional basis. It was established with the participation of six municipalities in the Suwa region, chambers of commerce, and local businesses as a base for wide-area manufacturing support. Starting with the operation of the "Suwa Region Industrial Messe" secretariat, its major initial mission, it has been developing multifaceted projects as a business supporter in the Suwa region, including business matching services, human resource development, consortium activities, and collaboration among industry, government, academia, and finance.