Chuko Flow Polyimide Adhesive Tape 'API-114C'
Excellent heat resistance! A non-silicone tape that can be removed without any adhesive residue even after heating at 260°C for 10 minutes on SUS plates.
"API-114C" is a non-silicone tape with excellent heat resistance. It has dimensional stability under high temperatures and does not use silicone-based materials. It can be removed from SUS plates without any adhesive residue even after being heated at 260°C for 10 minutes. In addition to being non-silicone, it also excels in electrical insulation and flame retardancy. 【Features】 ■ Can be removed from SUS plates without any adhesive residue even after being heated at 260°C for 10 minutes ■ Excellent dimensional stability under high temperatures ■ Does not use silicone-based materials *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications】 ■Thickness: 0.055(mm) ■Adhesive strength: 2.5(N/25mm) ■Breakdown voltage: 7.5(kV) ■Maximum operating temperature: 180(℃) *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Usage】 ■ Masking in the soldering process of printed circuit boards ■ Heat-resistant coating and heat protection ■ Masking in areas that dislike silicone *For more details, please refer to the PDF document or feel free to contact us.
