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High-precision shim plate manufacturing for semiconductor manufacturing equipment! SUS 0.01t and above.

We manufacture shim plates used for improving accuracy in semiconductor manufacturing equipment from thin sheets of SUS 0.01t and above. We can also accommodate different thicknesses.

It is used to improve the precision of shim plates for semiconductor braking devices. While high precision is required for the products, this is achieved using high-precision laser processing machines. In the case of SUS, production is possible from a plate thickness of 0.01 mm. We contribute to improving the precision of devices with shim plates that have undergone high-precision slitting and hole processing. Additionally, our company can also deliver different thicknesses of the same shape in a consolidated manner. We believe there are many sites that require adjustments for various plate thicknesses. If your company is looking for high-precision thin shim plates, please feel free to contact us.

Related Link - http://www.t-pla.co.jp/technology/

basic information

■ Square shims for semiconductor manufacturing equipment ■ Material: SUS/Aluminum/Brass/Copper/Beryllium copper ■ Processing method: High-precision fiber laser processing ■ Remarks: For semiconductor manufacturing equipment manufacturers

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Thin Plate Processing Product Examples

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