富山プレート Official site

Manufacturing shim for semiconductor manufacturing equipment using processing technology for SUS thin plates of 0.01 mm or more.

Perfect for semiconductor manufacturing equipment! Leave the production of shims made from SUS with a thickness of 0.01 mm and above to us. We can also accommodate complex shapes and different plate thicknesses.

We have numerous delivery records to companies that manufacture semiconductor production equipment. The reasons are: - High precision finishing with minimal burrs - Orders for SUS with thickness variations from 0.01 mm are possible - We can also process materials such as copper and brass with high precision. We can accommodate complex shapes and also accept orders for small lots, such as prototypes. If your company is facing challenges with thin plate processing, please feel free to contact us.

Related Link - http://www.t-pla.co.jp/technology/

basic information

■Name: 0.01mm SUS Ring Shim ■Specifications: 0.01mm SUS Thin Plate Processing Processed with a high-precision fiber laser with a beam diameter of 40µ.

Price range

Delivery Time

Applications/Examples of results

As a shim for semiconductor manufacturing equipment manufacturers.

Toyama Plate Co., Ltd. Company Information

PRODUCT

Thin Plate Processing Product Examples

TECHNICAL

News about this product(4)

Recommended products

Distributors