Product Categories
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Technical Data Summary
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YouTube lecture materials
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Pharmaceuticals-related
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Composite Materials Analysis Related
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Protein analysis related
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Biomaterials-related
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Differential Scanning Calorimeter (DSC)
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Thermogravimetric analysis device (TGA)
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DMA Measurement · Dynamic Mechanical Analysis Instruments · Solid Viscoelasticity Testing Equipment
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Thermogravimetric analysis device (TG-DSC, SDT)
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Steam adsorption and desorption measurement device (Discovery SA)
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Magnetic levitation high-temperature high-pressure thermal weight measurement device
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Thermal Conductivity Measurement Device (DTC-300)
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Thermal conductivity measurement device (FOX)
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Laser Flash Method Thermal Diffusivity Measurement Device (DLF)
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Thermal Expansion Rate Measurement Device (TMA)
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Thermal Expansion Rate Measurement Device (DIL)
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Heating microscope (HM867)
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Rheometer and viscoelasticity measurement device (DHR)
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Rheometer and viscoelasticity measurement device (ARES-G2)
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High Temperature Viscometer (VIS413)
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Rubber testing cure meter & viscoelasticity measurement device
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Fatigue testing & high-load viscoelasticity measurement device
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BioDynamic Testing Device Low Load Material Fatigue Testing Machine
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DuraPulse Stent Graft Testing Machine (SGT)
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Artificial heart valve durability testing device
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Isothermal calorimeter (TAM)
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Isothermal Titration Calorimeter (Affinity ITC)
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Differential Scanning Calorimeter for Biomacromolecules (nanoDSC)
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Cooler and air chiller system
Featured products
Products/Services(82items)
news list
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ARES-G3 & High-Speed Frequency Chirp Short Webinar
Event Date and Time: Thursday, July 2, 2026 For details and registration, please use the link below! https://pages.waters.com/2026-07-02-WBN-RH-APAC-JP-ARES-G3Webinar_LP-Registration.html 1:00 PM - 1:40 PM [Title] Accelerating TTS with the New ARES-G3: A New Approach to Frequency Sweeping Using High-Speed Frequency Chirp [Speaker] Masayoshi Takano, Application Department, TA Instruments Japan, Inc. Time-Temperature Superposition (TTS) is important for long-term property evaluation, but traditionally requires a significant amount of time for measurement. This presentation will introduce a method for conducting frequency sweeps and TTS analysis in a short time using the high-speed frequency Chirp technology of the ARES-G3. Based on examples of polymer melts and thermosetting resins, the application in research and development as well as quality control will be explained.
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Electronic Materials Analysis Collaborative Webinar: "From Nanoscale to Macroscopic Properties - A Multifaceted Analytical Approach for Thermal Management"
Event Date and Time: July 15, 2026 (Wednesday) For details and registration, please use the link below! https://pages.waters.com/2026-07-01-WBN-ELE-APAC-JP-ElectronicsThermalManagementWebinar_LP-Registration.html 1:00 PM - 1:40 PM [Title] Introduction to Thermoreflectance Microscopy for Evaluating Thermal Properties at Nano and Microscale [Speaker] Tomoya Uchiyama, Science Edge Inc. 2:00 PM - 2:20 PM [Title] Fundamental Property Evaluation of Materials Using Thermal Analysis and Rheology, and Thermal Management [Speaker] Yuki Kawada, Application Department, TA Instruments Japan Inc.
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Protein Analysis Webinar
Event Date and Time: July 9, 2026 (Friday) For details and registration, please use the link below! https://pages.waters.com/2026-07-09-WBN-MCM-APAC-JP-LifeScienceWebinarRS-DSC_LP-Registration.html 1:00 PM - 2:30 PM [Title] Unraveling Low Molecular Ligands, Next-Generation Antibodies, and Nanoparticles through Thermal Measurements [Speaker] Akira Nagamori, Associate Professor, Graduate School of Engineering, The University of Tokyo 2:30 PM - 3:00 PM [Title] Analyzing Molecular Interactions and Thermal Stability with ITC and DSC - Measurement Examples using Affinity ITC / NanoDSC / RS-DSC - [Speaker] Minako Maeda, Application Department, TA Instruments Japan, Inc.
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April 2026! Webinar on Electronic Material Analysis: Conductive Paste
Event Date and Time: April 20, 2026 (Monday) For details and registration, please use the link below! https://pages.waters.com/2026-04-20-WBN-ELE-APAC-JP-ElectronicMaterialAnalysisSeminarConductivePaste_LP-Registration1.html 1:00 PM - 2:30 PM [Title] Measurement and Analysis Framework for Dynamic Percolation Control of Conductive Paste - A Composite Measurement Approach to Capture Structural Development During the Process - [Speaker] Masahiro Inoue, Associate Professor, Graduate School of Science and Technology, Gunma University 2:30 PM - 3:00 PM [Title] In-situ Evaluation of the Sintering Process of Conductive Ink Using Rheo-Impedance and Thermal Analysis [Speaker] Yuki Kawada, Application Department, TA Instruments Japan Co., Ltd.
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August Event! Polymer Evaluation Webinar (Rheology)
Date and Time: August 29, 2024 (Thursday) For details and registration, please use the link below! https://pages.waters.com/2024-08-29-WBN-TAJPPolymerEvaluationSeminarRheology_LP-Registration1.html 1:00 PM - 3:00 PM [Title] Fundamentals of Viscoelastic Measurement Using Rotational Rheometers and Applications to Polymer Materials [Overview] Rheology is the scientific field concerning the deformation and flow of materials, utilized across a wide range of markets including petrochemicals, food, and pharmaceuticals. In polymers, rheological measurement techniques significantly cover the manufacturing value chain from synthesis to formulation, process characteristics, and the performance of final products. This presentation will focus on the fundamentals of rotational rheometers, followed by examples of polymer rheology analysis centered on thermoplastic and thermosetting resins, as well as elastomers. [Speaker] Masayoshi Takano, Application Department, TA Instruments
AboutTA Instruments Japan
(TAInstruments)
World leader in thermal analysis, rheology, microcalorimetry, and mechanical analysis.
TA Instruments Japan is a wholly-owned subsidiary of TA Instruments in Japan. We sell and provide maintenance support for thermal analysis, rheology, microcalorimeters, and mechanical analysis equipment, conduct demonstration measurements, and hold technical seminars, offering the latest information on materials and engaging in the development of measurement technologies for materials. 【Main Equipment Handled】 ☆ Thermal Analysis / Differential Scanning Calorimeter (DSC), Thermogravimetric Analyzer (TGA), Simultaneous Differential Thermal Analysis (SDT/TG-DTA), Vapor Adsorption/Desorption Analyzer (Q5000SA) ☆ Viscoelastic Measurement (Rheology) / Rotational Rheometer (DHR・ARES), Dynamic Mechanical Analyzer (RSA・DMA・EF3200), Rubber Testing Cure Meter (RPA) ☆ Microcalorimetry / Isothermal Titration Calorimeter (ITC), Microcalorimeter (NanoDSC), Isothermal Calorimeter (TAM) ☆ Thermal Property Measurement Equipment / Thermal Conductivity Meter (DTC・FOX), Thermal Diffusivity Meter (DLF, DXF), Thermal Expansion Meter (TMA, DIL), Optical Thermal Expansion Meter (ODP, HM) ☆ Fatigue Testing Machines / ElectroForce Series, BioDynamic Series








