Heat dissipation substrate (aluminum, copper base, thick copper)
Can protect components from heat with high thermal conductivity and heat dissipation! Widely usable from LED lighting to automotive applications.
The "heat dissipation substrate" we handle is a printed circuit board that has enhanced heat dissipation compared to standard substrates. It is necessary when using components that generate a large amount of heat, such as LEDs and power devices, and it is a substrate that can protect components from heat with high thermal conductivity and heat dissipation. Additionally, by using thick copper, it can quickly dissipate heat in the lateral direction where the electrodes are located, making it widely used from LED lighting to automotive applications. 【Features】 ■ Necessary when using components that generate a large amount of heat, such as LEDs and power devices ■ A substrate that can protect components from heat with high thermal conductivity and heat dissipation ■ Can quickly dissipate heat in the lateral direction where the electrodes are located by using thick copper ■ Widely used from LED lighting to automotive applications *For more details, please refer to the related links or feel free to contact us.
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Our company specializes in etching processing, electroforming, and the production of printed circuit boards, with numerous factories located nationwide. We offer a wide range of services, from texture processing for mass production molds such as etching, sandblasting, Ceracib, and Ceracoat, to texture processing for prototypes and molded products like Banatone and Realtech. Please feel free to contact us with any inquiries.