Thin substrate
We will accommodate from 0.1t! By using printing methods, we also contribute to cost reduction.
The "thin substrates" we handle are rigid substrates with a thickness of 0.1 mm or more that can be mounted on curved surfaces. By making them thin, they can be used while maintaining the curve without breaking, and by reducing the thickness of the base material, they facilitate heat transfer, providing heat dissipation effects and reducing thermal resistance. Additionally, it allows for thinner and lighter products, and by using printing methods, we contribute to cost reduction. 【Features】 ■ Can be mounted on curved surfaces ■ Can be used while maintaining the curve without breaking ■ Facilitates heat transfer, providing heat dissipation effects and reducing thermal resistance ■ Allows for thinner and lighter products ■ Contributes to cost reduction by using printing methods *For more details, please feel free to contact us.
basic information
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Price range
Delivery Time
Applications/Examples of results
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Distributors
Our company specializes in etching processing, electroforming, and the production of printed circuit boards, with numerous factories located nationwide. We offer a wide range of services, from texture processing for mass production molds such as etching, sandblasting, Ceracib, and Ceracoat, to texture processing for prototypes and molded products like Banatone and Realtech. Please feel free to contact us with any inquiries.