We have newly created a product page for the Tech Polymer "Low Dielectric Resin Filler"!! This is an additive with low dielectric properties, meeting the requirements of Dk 3.0 and Df 0.002 or lower for 5G and 6G applications. We offer a lineup of hollow type (non-foamed) with excellent low dielectric rate and solid type considering handling properties. 【Intended Applications】 Additives for materials in semiconductor packaging and mounting fields. 【Product Lineup】 Particle Structure: Hollow Type Particle Structure: Solid Type For information on composition, particle size, hollow ratio, apparent density, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation.

We have newly created a product page for the Tech Polymer "Disappearing Acrylic Binder"!! It is a methacrylic resin microparticle with excellent thermal decomposition properties under a non-oxidizing atmosphere. It can be used as a binder that leaves no residues such as carbides when sintering ceramic or metal powders. It has excellent solubility in various solvents, and viscosity can be adjusted according to your usage.