Report: Detailed Structural Analysis of the MDM9235 Modem Logic
Detailed structural analysis of the 20 nm HKMG Qualcomm Gobi.
This report is a detailed structural analysis (LDSA) of the 20 nm node Qualcomm MDM9235 modem. The MDM9235 is the fourth generation Qualcomm Gobi 9x35 series modem and is the first modem from Qualcomm manufactured using a 20 nm CMOS process. The MDM9235 is paired with the Qualcomm Snapdragon 805 application processor to support 4G LTE-A Cat. 6 data rates (301.5 Mbps) and 4K video content. The MDM9235 is manufactured by TSMC using 10 layers of metallization (9-Cu, 1-Al), with 20 nm node high-k metal gate (HKMG) transistors fabricated on a bulk silicon substrate using a gate length process. It features a minimum contacted gate pitch of 90 nm. 【Features】 ○ Understanding of key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.
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【Table of Contents】 ○Executive Summary ○Device Summary ○Process Summary ○1.0 Package and Die Markings ○2.0 Process ○3.0 Critical Dimensions ○4.0 6T SRAM Cell ○5.0 Major Findings ●For more details, please contact us or download the catalog.
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