JISSO PROTEC in JPCA2025
テクノアルファ
We will be exhibiting at "JISSO PROTEC" within JPCA2025, which will be held at Tokyo Big Sight from June 4, 2025. Please be sure to stop by our booth when you visit. Booth Number: East Hall 4, 4A-03 【Exhibited Products】 - Manual Die Bonder / Flip Chip Bonder - Chip Mounter / Multi Die Bonder - Bond Tester - Electronic Circuit Printer - Area Laser Reflow System
-
Date and time Wednesday, Jun 04, 2025 ～ Friday, Jun 06, 2025
10:00 AM ～ 05:00 PM
- Capital Tokyo Big Sight East Exhibition Hall *Access https://www.bigsight.jp/visitor/access/
- Entry fee Free
